IPC-A-630 CHINESE 2013 Edition, September 1, 2013 Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures
IPC-HDBK-830 CD Revision A, August 1, 2013 Guidelines for Design, Selection and Application of Conformal Coatings
IPC-HDBK-830 Revision A, August 1, 2013 Guidelines for Design, Selection and Application of Conformal Coatings
J-STD-006 CHINESE Revision C, July 1, 2013 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC-9641 2013 Edition, June 1, 2013 High Temperature Printed Board Flatness Guideline
IPC/JPCA-2291 2013 Edition, June 1, 2013 Design Guideline for Printed Electronics
IPC/ECA J-STD-002 CHINESE Revision D, June 1, 2013 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC-T-50 GERMAN Revision K, June 1, 2013 Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC/WHMA-A-620-S CHINESE Revision BS, June 1, 2013 Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-5703 2013 Edition, May 1, 2013 Cleanliness Guidelines for Printed Board Fabricators
IPC-4412 CHINESE Revision B, May 1, 2013 Specification for Finished Fabric Woven from "E" Glass for Printed Boards
IPC-7095 Revision C, January 1, 2013 Design and Assembly Process Implementation for BGAs