IPC-TM-650 2.6.2.1 Revision A, May 1, 1986 Water Absorption, Metal Clad Plastic Laminates
IPC-TM-650 2.3.18 Revision A, April 1, 1986 Gel Time for Prepreg Materials
IPC-TR-484 1986 Edition, April 1, 1986 Results of IPC Copper Foil Ductility Round Robin Study
IPC-FC-233 Revision A, February 1, 1986 Flexible Adhesive Bonding Films
IPC-TA-720 1986 Edition, January 1, 1986 Technology Assessment of Laminates
IPC-D-352 1985 Edition, August 1, 1985 Electronic Design Data Description for Printed Boards in Digital Form
IPC-NC-349 1985 Edition, August 1, 1985 Computer Numerical Control Formatting for Drillers and Routers
IPC-D-351 1985 Edition, August 1, 1985 Printed Board Drawings in Digital Form
IPC-TR-578 1984 Edition, September 1, 1984 Leading Edge Manufacturing Technology Report Results of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double Sided Printed Wiring Boards
IPC-D-322 84th Edition, September 1, 1984 Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes
IPC-FC-221 Revision A, 1984 Specification for Flat-Copper Conductors for Flat Cables
IPC-TR-464 1984 Edition, April 1, 1984 Accelerated Aging for Solderability Evaluations