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IPC-6013
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IPC-6013 Revision D, September 1, 2017 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
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Description / Abstract:
Statement of Scope
This specification covers qualification and performance requirements of flexible printed boards. The flexible printed board may be single-sided, double-sided, multilayer, or rigid-flex multilayer. All of these constructions may or may not include stiffeners, plated-through holes (PTHs), and blind/buried vias.
The flexible or rigid-flex printed board may contain build up High Density Interconnect (HDI) layers. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017.
The rigid section of the printed board may contain a metal core or external metal heat frame, which may be active or nonactive.
Revision level changes are described in 1.7.
Purpose The purpose of this specification is to provide requirements for qualification and performance of flexible printed boards designed to IPC-2221 and IPC-2223.
This specification covers qualification and performance requirements of flexible printed boards. The flexible printed board may be single-sided, double-sided, multilayer, or rigid-flex multilayer. All of these constructions may or may not include stiffeners, plated-through holes (PTHs), and blind/buried vias.
The flexible or rigid-flex printed board may contain build up High Density Interconnect (HDI) layers. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017.
The rigid section of the printed board may contain a metal core or external metal heat frame, which may be active or nonactive.
Revision level changes are described in 1.7.
Purpose The purpose of this specification is to provide requirements for qualification and performance of flexible printed boards designed to IPC-2221 and IPC-2223.