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IPC-2226
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IPC-2226 Revision A, September 1, 2017 Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
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Description / Abstract:
This standard establishes requirements and considerations for the design of organic and inorganic high density interconnect (HDI) printed boards and structures for component mounting and interconnections.
Purpose The requirements contained herein are intended to establish design principles and recommendations that shall be used in conjunction with the detailed requirements of IPC-2221. In addition, when the core material reflects requirements identified in the sectional standards (IPC-2222, IPC-2223, and IPC-2225), that information becomes a mandatory part of this standard.
The standard provides recommendations for signal, power, ground, and mixed distribution layers, dielectric separation, via formation and metallization requirements and other design features that are necessary for HDI substrates.
Purpose The requirements contained herein are intended to establish design principles and recommendations that shall be used in conjunction with the detailed requirements of IPC-2221. In addition, when the core material reflects requirements identified in the sectional standards (IPC-2222, IPC-2223, and IPC-2225), that information becomes a mandatory part of this standard.
The standard provides recommendations for signal, power, ground, and mixed distribution layers, dielectric separation, via formation and metallization requirements and other design features that are necessary for HDI substrates.