IPC-7711/7721

Description / Abstract: This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of the Product Assurance Committee of the IPC. This revision includes expanded coverage for lead free processes, and additional inspection guidelines for operations such as repair that may not have other published criteria.

This document does not limit the maximum number of rework, modification or repair actions to a Printed Circuit Assembly.

Purpose This document prescribes the procedural requirements, tools, materials and methods to be used in the rework, repair, modification, overhaul or restoration of electronic products. Although this document is based in large part on the Product Class definitions used in IPC documents such as J-STD-001 or IPC-A-610, this document should be considered applicable to any type of electronic equipment. When invoked by contract as the controlling document for the rework, repair, modification, overhaul or restoration of products, the requirements flowdown apply.

IPC has identified the most common equipment and process in order to perform a specific repair or rework. It is possible that alternate equipment and processes can be used to make the same repair/rework. If alternate equipment or processes are used, it is up to the user to ensure the equipment/processes do not damage the assembly and meet the intent of Section 1.5.1.1 (Levels of Conformance) for the alternate equipment/processes utilized.