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IPC-7092
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IPC-7092 2015 Edition, February 1, 2015 Design and Assembly Process Implementation for Embedded Components
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Description / Abstract:
This document describes the design and assembly challenges for
implementing passive and active components, in either formed or
placed methodology, into a printed board. The completed structure
including internal electronic components is ready for surface mount
and/or through-hole component attachment. The multilayered
structure becomes a complete product ready for further processing
in an assembly process and can be made from organic, inorganic
(ceramic) or both types of material.
Purpose The target audiences for this document are managers, design and process engineers, and technicians who develop electronic assemblies that include an embedded component printed board as a part of the product. The purpose is to provide useful and practical information to those who are involved in the decision making of either formed or placed, passive or active components and to help establish inspection techniques, testing processes, and reliability validations.
Purpose The target audiences for this document are managers, design and process engineers, and technicians who develop electronic assemblies that include an embedded component printed board as a part of the product. The purpose is to provide useful and practical information to those who are involved in the decision making of either formed or placed, passive or active components and to help establish inspection techniques, testing processes, and reliability validations.