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IPC-SM-817
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IPC-SM-817 Revision A, December 1, 2014 General Requirements for Dielectric Surface Mounting Adhesives
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Description / Abstract:
This document covers requirements and test methods for
dielectric adhesives used to hold components in place from mounting
to the soldering process and for their long term properties as a
part of the printed wiring board.
Purpose
This standard defines dielectric surface mounting adhesives through specification of test methods and inspection criteria. The adhesives include those intended for application by pin transfer, syringe and screening/stenciling. Cure methods include ultra-violet (UV) or visible light, heat or ambient conditions.
Purpose
This standard defines dielectric surface mounting adhesives through specification of test methods and inspection criteria. The adhesives include those intended for application by pin transfer, syringe and screening/stenciling. Cure methods include ultra-violet (UV) or visible light, heat or ambient conditions.