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IPC-FC-234
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IPC-FC-234 Revision A, November 1, 2014 Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards
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Description / Abstract:
This document provides guidelines for the use of PSAs in single
or double sided flexible printed circuits (see Figures A2 through
A8), membrane switches (see Figures A9 through A12) and component
attachments (see Figures A1 and A13). In addition, the guideline
describes the type of materials and processes that may be used to
accomplish proper assemblies.
Purpose
This document is intended as a guide to the user by seeking answers to questions related to accepted, effective methods for the use of PSAs in FPC assemblies. The methods described herein are not specifications. PSA technology is continuously evolving such that applications and requirements may vary beyond the scope of this publication.
Purpose
This document is intended as a guide to the user by seeking answers to questions related to accepted, effective methods for the use of PSAs in FPC assemblies. The methods described herein are not specifications. PSA technology is continuously evolving such that applications and requirements may vary beyond the scope of this publication.