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IPC-MC-324
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IPC-MC-324 1988 Edition, October 1, 1988 Performance Specification for Metal Core Boards
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Description / Abstract:
This specification establishes the qualification and performance
requirements for a metal core packaging interconnection (P/I)
structure, hereafter referred to as a metal core board. Metal core
boards consist of at least one conductive pattern on each side of
an insulated metal substrate. Interconnection between conductive
patterns shall be made using plated-through holes. The metal
substrate shall be an integral part of the metal core board prior
to interconnecting the conductive pattern.
Purpose. The purpose of this specification is to provide classes of requirements for performance/acceptance of metal core boards for industry and government use.
Purpose. The purpose of this specification is to provide classes of requirements for performance/acceptance of metal core boards for industry and government use.