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IPC-ML-950
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IPC-ML-950 Revision C, November 1, 1986 Performance Specification for Rigid Multilayer Printed Boards
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Description / Abstract:
This specification covers qualification and performance of rigid
multilayer printed boards with platedthrough holes. Circuitry may
be bare copper, metallic overplated or coated, unfused, fused,
leveled etc.
Purpose. The purpose of this specification is to provide classes of requirements for performance/acceptance of multilayer printed boards for industry and government use, (excluding multilayer flexible and rigid-flex products).
Purpose. The purpose of this specification is to provide classes of requirements for performance/acceptance of multilayer printed boards for industry and government use, (excluding multilayer flexible and rigid-flex products).