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IPC-TR-578
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IPC-TR-578 1984 Edition, September 1, 1984 Leading Edge Manufacturing Technology Report Results of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double Sided Printed Wiring Boards
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Description / Abstract:
OBJECTIVE
The "Program For Round Robin Evaluation of High Density, Double-Sided Copper Only (fine line, small plated-through hole) Printed Wiring Boards" has the following objectives:
The "Program For Round Robin Evaluation of High Density, Double-Sided Copper Only (fine line, small plated-through hole) Printed Wiring Boards" has the following objectives:
- To evaluate the state-of-the-art in the international printed wiring board industry for fabrication of high density, double sided, rigid bare copper boards.
- Collect data on different manufacturing methods and substrates used to fabricate printed wiring boards.
- Include all recognized printed wiring board manufacturing methods: i.e., subtractive, thin foil, semi-additive and fully-additive.
- Determine the reliability and quality of the boards producedu sing recognized industry testing practices and procedures.