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MIL-PRF-31032/2:2018
New product
MIL-PRF-31032/2:2018
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, With or Without Plated-Through Holes, for Soldered Part MountingMore info
| Author | US DOD |
|---|---|
| Editor | DODNAV |
| Document type | Standard |
| Format | File |
| ICS | 31.180 : Printed circuits and boards
|
| Number of pages | 26 |
| Replace | MIL-PRF-31032/2 (2017-06-02) |
| Year | 2018 |
| Document history | MIL-PRF-31032/2 (2018-06-12) |
| Country | USA |
| Keyword | MIL 31032;MIL-PRF-31032;31032;MIL-PRF-31032/2C(1) |