J-STD-033 Revision D, April 1, 2018 Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
J-STD-001-S Revision GS, March 1, 2018 Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies
IPC-2292 2018 Edition, March 1, 2018 Design Standard for Printed Electronics on Flexible Substrates
IPC/WHMA-A-620-S Revision CS, March 1, 2018 Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C
IPC/PERM-2901 2018 Edition, February 1, 2018 Pb-free Design & Assembly Implementation Guide
IPC-4591 Revision A, January 1, 2018 Requirements for Printed Electronics Functional Conductive Materials
IPC-6903 Revision A, January 1, 2018 Terms and Definitions for the Design and Manufacture of Printed Electronics
IPC-7094 Revision A, January 1, 2018 Design and Assembly Process Implementation for Flip Chip and Die-Size Components
IPC-7621 Revision A, January 1, 2018 Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
J-STD-001 CHINESE Revision G, October 1, 2017 Requirements for Soldered Electrical and Electronic Assemblies
J-STD-001 ESTONIAN Revision G, October 1, 2017 Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610 SPANISH Revision G, October 1, 2017 Acceptability of Electronic Assemblies