J-STD-001 REDLINE Revision G, October 1, 2017 Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610 HUNGARIAN Revision G, October 1, 2017 Acceptability of Electronic Assemblies
IPC-6013 Revision D, September 1, 2017 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-2226 Revision A, September 1, 2017 Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
IPC-9505 2017 Edition, September 1, 2017 Guideline Methodology for Assessing Component and Cleaning Materials Compatibility
IPC-WP-019 2017 Edition, August 1, 2017 An Overview on Global Change in Ionic Cleanliness Requirements
IPC-4552 Revision A, August 1, 2017 Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
IPC-A-640 2017 Edition, July 1, 2017 Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
IPC-7091 2017 Edition, June 1, 2017 Design and Assembly Process Implementation of 3D Components
IPC-4921 Revision A, May 1, 2017 Requirements for Printed Electronics Base Materials (Substrates)
IPC-7530 Revision A, March 1, 2017 Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
IPC-1401 CHINESE 2017 Edition, March 1, 2017 Corporate Social Responsibility and Sustainability Protocols for Electronic Manufacturing Industry