IPC-4110 1998 Edition, August 1, 1998 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
IPC-TR-465-2 1993 Edition, July 1, 1993 Effect of Steam Aging Time and Temperature on Solderability Test Results
IPC-TM-650 2.4.22.1C Revision C, May 1, 1993 Bow and Twist - Laminate
IPC-QE-615 1993 Edition, March 1, 1993 Electronic Assembly Evaluation Handbook
IPC-TR-465-1 1993 Edition, January 1, 1993 Round Robin Test on Steam Ager Temperature Control Stability
IPC-SM-785 1992 Edition, November 1, 1992 Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
IPC-SM-785 CHINESE 1992 Edition, November 1, 1992 Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
IPC-TP-1043 1992 Edition, October 1, 1992 IPC Cleaning and Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1: B-24 Interactions of Water Soluble Fluxes with Printed Wiring Board Substrates/ Metallizations (IPC TP-1043 and TP-1044 Replace TR-581)
IPC-TP-1044 1992 Edition, October 1, 1992 IPC Cleaning and Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2: B-36 Comparison to Phase 1 Rosin Benchmark (IPC TP-1043 and TP-1044 Replace TR-581)
IPC-MC-790 1992 Edition, August 1, 1992 Guidelines for Multichip Module Technology Utilization
IPC-D-350 Revision D, July 1, 1992 Printed Board Description in Digital Form
IPC-L-109 Revision B, July 1, 1992 Specification for Resin Impregnated Fabric (Prepreg) for Multilayer Printed Boards