IPC-9191 1999 Edition, November 1, 1999 General Guidelines for Implementation of Statistical Process Control (SPC)
IPC-A-600 FINNISH Revision F, November 1, 1999 Acceptability of Printed Boards
IPC/EIA J-STD-028 1999 Edition, August 1, 1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
IPC-9504 1998 Edition, June 1, 1998 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
IPC-TM-650 2.4.3 Revision D, May 1, 1998 Flexural Endurance, Flexible Printed Wiring Materials
IPC-TM-650 2.3.17.1 Revision B, May 1, 1998 Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films
IPC-TM-650 2.2.4 Revision C, May 1, 1998 Dimensional Stability, Flexible Dielectric Materials
IPC-2225 1998 Edition, May 1, 1998 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
IPC-TA-724 1998 Edition, April 1, 1998 Technology Assessment Series on Cleanrooms
IPC-7721 1998 Edition, February 1998 Repair and Modification of Printed Boards and Electronic Assemblies
IPC-TM-650 2.4.42.3 1998 Edition, February 1, 1998 Wire Bond Pull Strength
IPC-6015 1998 Edition, February 1, 1998 Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures