IPC-2224 1998 Edition, January 1, 1998 Sectional Standard for Design of PWBs for PC Cards
IPC-TP-1114 1998 Edition, January 1, 1998 Laymans´s Guide to Qualifying a Process to J-STD-001B
IPC-CF-152 Revision B, December 1, 1997 Composite Metallic Material Specification for Printed Wiring Board
IPC-PE-740 Revision A, December 1, 1997 Troubleshooting for Printed Board Manufacture and Assembly
IPC-QL-653 Revision A, November 1, 1997 Certification of Facilities That Inspect/Test Printed Boards, Components and Materials
IPC-TM-650 2.3.4 Revision B, August 1, 1997 Chemical Resistance, Marking Paints and Inks
IPC/EIA J-STD-026 1999 Edition, August 1, 1999 Semiconductor Design Standard for Flip Chip Applications
IPC-SC-60 Revision A, August 1, 1999 Post Solder Solvent Cleaning Handbook
IPC-TM-650 2.4.22 Revision C, June 1, 1999 Bow and Twist (Percentage)
IPC-6016 1999 Edition, May 1, 1999 Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards
IPC/JPCA-4104 1999 Edition, May 1, 1999 Specification for High Density Interconnect (HDI) and Microvia Materials
IPC-9502 1999 Edition, April 1, 1999 PWB Assembly Soldering Process Guideline for Electronic Components